Our adhesive systems for the solid wood lamination, such as edge glued panels (EGP), offer fast bonding solutions to increase productivity during the manufacturing process.
AkzoNobel helps you to accomplish a cost efficient production with a competitive product by offering high-speed and strong-bonding solutions together with ultra-low-emitting formaldehyde (ULEF) systems.
Whether small or large scale production, we provide the right solution to optimize your productivity and minimize the probability of quality rejections. By carefully considering your production line and gluing conditions as well as wood varieties used, our technicians can design a unique solution meeting both high-quality standards and environmental requirements.
Our product range includes:
- Ultra-low-emitting formaldehyde (ULEF) systems, offering strong glue joints, and supporting both high frequency and hot presses
- Non-added formaldehyde (NAF) systems based on PVAc and EPI chemistries; offering heat resistance, high quality and high moisture resistance
- UF mixers for two-component systems as well as chillers to prolong the open time
Related Adhesive Technologies:
|PRODUCT GROUPS||MAIN CHARACTERISTICS||MAIN APPLICATIONS|
|Urea-formaldehyde adhesives||Cost-efficient thermosetting systems|
|Polyvinyl acetate||Dispersion-based thermoplastic adhesives|
|Emulsion Polymer systems||High performance adhesive systems for high water and weather resistance|
|Melamine based adhesives for structural||High performance adhesive systems for load bearing constructions|
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